NXP Semiconductors - MIMXRT1064DVL6AR

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MIMXRT1064DVL6AR by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MIMXRT1064DVL6AR
Description MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet MIMXRT1064DVL6AR Datasheet
In Stock1,616
NAME DESCRIPTION
Minimum Supply Voltage: 1.25 V
Package Body Material: PLASTIC/EPOXY
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.43 mm
Surface Mount: YES
Maximum Supply Current: 100 mA
On Chip Data RAM Width: 8
No. of Terminals: 196
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
RAM Words: 1048576
JESD-30 Code: S-PBGA-B196
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 10 mm
Moisture Sensitivity Level (MSL): 3
Speed: 600 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.3 V
Low Power Mode: YES
Boundary Scan: YES
Minimum Operating Temperature: 0 Cel
Package Equivalence Code: BGA196.14X14,25
Length: 10 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .65 mm
Temperature Grade: OTHER
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