NXP Semiconductors - MK22FN256VMP10

MK22FN256VMP10 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MK22FN256VMP10
Description MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 64; Package Code: BGA; Package Shape: RECTANGULAR; Integrated Cache: NO;
Datasheet MK22FN256VMP10 Datasheet
In Stock4,058
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: PLASTIC/EPOXY
Integrated Cache: NO
Surface Mount: YES
ADC Channels: YES
On Chip Data RAM Width: 8
No. of Terminals: 64
No. of Timers: 21
DMA Channels: YES
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY
No. of DMA Channels: 16
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: R-PBGA-B64
Package Shape: RECTANGULAR
ROM Words: 262144
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: BGA
Speed: 120 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 3.6 V
RAM Bytes: 49152
Low Power Mode: YES
Boundary Scan: NO
External Data Bus Width: 0
Peripherals: COMPARATOR(2), DMA(16), RTC, TIMER(21), WDT
DAC Channels: YES
Minimum Operating Temperature: -40 Cel
Digital To Analog Convertors: 1-Ch 12-Bit
PWM Channels: YES
On Chip Program ROM Width: 8
Connectivity: I2C(2), I2S, SPI(2), UART(4), USB
ROM Programmability: FLASH
Analog To Digital Convertors: 2-Ch 16-Bit
CPU Family: CORTEX-M4
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