NXP Semiconductors - MM912KS812AMAFR2

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MM912KS812AMAFR2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MM912KS812AMAFR2
Description MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: HLFQFP; Package Shape: SQUARE;
In Stock1,242
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Terminal Finish: Tin (Sn)
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
No. of Terminals: 100
Terminal Position: QUAD
Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
Length: 14 mm
Technology: CMOS
JESD-30 Code: S-PQFP-G100
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 125 Cel
Peak Reflow Temperature (C): 260
Package Code: HLFQFP
Width: 14 mm
Terminal Pitch: .5 mm
Temperature Grade: AUTOMOTIVE
Moisture Sensitivity Level (MSL): 3
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