NXP Semiconductors - MMC2001HCAB33B

MMC2001HCAB33B by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MMC2001HCAB33B
Description MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; On Chip Data RAM Width: 8;
Datasheet MMC2001HCAB33B Datasheet
In Stock582
NAME DESCRIPTION
Minimum Supply Voltage: 1.8 V
Package Body Material: PLASTIC/EPOXY
Integrated Cache: NO
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Maximum Supply Current: 40 mA
On Chip Data RAM Width: 8
No. of Terminals: 144
No. of Serial I/Os: 2
Terminal Position: QUAD
Format: FIXED POINT
Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH
Address Bus Width: 22
Technology: CMOS
RAM Words: 32768
JESD-30 Code: S-PQFP-G144
Maximum Clock Frequency: 16.38 MHz
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: LFQFP
Width: 20 mm
Moisture Sensitivity Level (MSL): 3
Speed: 34 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 3.6 V
No. of External Interrupts: 8
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 16
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: QFP144,.87SQ,20
Length: 20 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .5 mm
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Pricing (USD)

Qty. Unit Price Ext. Price
582 $32.290 $18,792.780

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