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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MMDS09254HT1 |
| Description | TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; JESD-609 Code: e3; |
| Datasheet | MMDS09254HT1 Datasheet |
| In Stock | 503 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 5 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .9 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN |
| JESD-609 Code: | e3 |
| No. of Functions: | 1 |
| No. of Terminals: | 32 |
| Package Equivalence Code: | LCC32,.23,20 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Length: | 6 mm |
| JESD-30 Code: | S-PQCC-N32 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 150 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | HVQCCN |
| Width: | 6 mm |
| Terminal Pitch: | .5 mm |
| Moisture Sensitivity Level (MSL): | 3 |
