NXP Semiconductors - MMG30271BT1

MMG30271BT1 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MMG30271BT1
Description TELECOM CIRCUIT; Terminal Form: FLAT; No. of Terminals: 3; Package Code: LSOF; Package Shape: RECTANGULAR; JESD-30 Code: R-PSSO-F3;
Datasheet MMG30271BT1 Datasheet
In Stock2,103
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Time At Peak Reflow Temperature (s): 40
Telecom IC Type: TELECOM CIRCUIT
Maximum Seated Height: 1.6 mm
Surface Mount: YES
No. of Functions: 1
No. of Terminals: 3
Terminal Position: SINGLE
Package Style (Meter): SMALL OUTLINE, LOW PROFILE
Length: 4.5 mm
JESD-30 Code: R-PSSO-F3
Package Shape: RECTANGULAR
Terminal Form: FLAT
Peak Reflow Temperature (C): 260
Package Code: LSOF
Width: 2.5 mm
Terminal Pitch: 1.5 mm
Moisture Sensitivity Level (MSL): 1
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Pricing (USD)

Qty. Unit Price Ext. Price
2,103 $1.940 $4,079.820

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