NXP Semiconductors - MPC5125YVN400R

MPC5125YVN400R by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC5125YVN400R
Description MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
Datasheet MPC5125YVN400R Datasheet
In Stock651
NAME DESCRIPTION
Minimum Supply Voltage: 1.33 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.4 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 2.55 mm
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: TIN SILVER
ADC Channels: NO
No. of Terminals: 324
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
No. of I/O Lines: 128
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: S-PBGA-B324
Maximum Clock Frequency: 35 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Speed: 400 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 1.47 V
External Data Bus Width: 8
Bit Size: 32
DAC Channels: NO
JESD-609 Code: e2
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA324,22X22,40
Length: 23 mm
PWM Channels: NO
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 1.4,3.3
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