MPC5533MVZ80R by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MPC5533MVZ80R
Description	MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 324; Package Code: HBGA; Package Shape: SQUARE;
Datasheet	MPC5533MVZ80R Datasheet
In Stock	1,935

NAME	DESCRIPTION
Minimum Supply Voltage:	1.35 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1.5 V
Maximum Seated Height:	2.55 mm
Sub-Category:	Microcontrollers
Surface Mount:	YES
Maximum Supply Current:	250 mA
ADC Channels:	YES
No. of Terminals:	324
DMA Channels:	NO
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, HEAT SINK/SLUG
Address Bus Width:	0
Technology:	CMOS
JESD-30 Code:	S-PBGA-B324
Maximum Clock Frequency:	80 MHz
Package Shape:	SQUARE
ROM Words:	196608
Terminal Form:	BALL
Maximum Operating Temperature:	125 Cel
Package Code:	HBGA
Width:	23 mm
Speed:	80 rpm
Peripheral IC Type:	MICROCONTROLLER, RISC
Maximum Supply Voltage:	1.65 V
RAM Bytes:	49152
External Data Bus Width:	0
Bit Size:	32
DAC Channels:	NO
Minimum Operating Temperature:	-40 Cel
Qualification:	Not Qualified
Package Equivalence Code:	BGA324,22X22,40
Length:	23 mm
PWM Channels:	NO
ROM Programmability:	FLASH
Terminal Pitch:	1 mm
Temperature Grade:	AUTOMOTIVE
Power Supplies (V):	1.5,3.3,5

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,935	-	-

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