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Manufacturer | NXP Semiconductors |
---|---|
Manufacturer's Part Number | MPC5533MZQ66R |
Description | MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 324; Package Code: HBGA; Package Shape: SQUARE; |
Datasheet | MPC5533MZQ66R Datasheet |
In Stock | 4,388 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.35 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.5 V |
Maximum Seated Height: | 2.55 mm |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
Maximum Supply Current: | 250 mA |
ADC Channels: | YES |
No. of Terminals: | 324 |
DMA Channels: | NO |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Address Bus Width: | 0 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B324 |
Maximum Clock Frequency: | 66 MHz |
Package Shape: | SQUARE |
ROM Words: | 196608 |
Terminal Form: | BALL |
Maximum Operating Temperature: | 125 Cel |
Package Code: | HBGA |
Width: | 23 mm |
Speed: | 66 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Supply Voltage: | 1.65 V |
RAM Bytes: | 49152 |
External Data Bus Width: | 0 |
Bit Size: | 32 |
DAC Channels: | NO |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA324,22X22,40 |
Length: | 23 mm |
PWM Channels: | NO |
ROM Programmability: | FLASH |
Terminal Pitch: | 1 mm |
Temperature Grade: | AUTOMOTIVE |
Power Supplies (V): | 1.5,3.3,5 |