NXP Semiconductors - MPC5553MVZ132

MPC5553MVZ132 by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC5553MVZ132
Description MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
In Stock2,979
NAME DESCRIPTION
Minimum Supply Voltage: 1.35 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.5 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 2.55 mm
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 510 mA
Terminal Finish: TIN SILVER COPPER
ADC Channels: YES
No. of Terminals: 324
DMA Channels: NO
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Address Bus Width: 24
Technology: CMOS
JESD-30 Code: S-PBGA-B324
Maximum Clock Frequency: 20 MHz
Package Shape: SQUARE
ROM Words: 1572864
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Speed: 132 rpm
Peripheral IC Type: MICROCONTROLLER
Maximum Supply Voltage: 1.65 V
RAM Bytes: 65536
External Data Bus Width: 32
Bit Size: 32
DAC Channels: NO
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA324,22X22,40
Length: 23 mm
PWM Channels: YES
Additional Features: ALSO REQUIRES 3.3V SUPPLY
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 1.5,3.3,5
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
2,979 $30.110 $89,697.690

Popular Products

Category Top Products