NXP Semiconductors - MPC5554MVR112

MPC5554MVR112 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC5554MVR112
Description MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: HBGA; Package Shape: SQUARE;
Datasheet MPC5554MVR112 Datasheet
In Stock4,682
NAME DESCRIPTION
Minimum Supply Voltage: 1.35 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.5 V
Maximum Seated Height: 2.55 mm
Sub-Category: Microcontrollers
Surface Mount: YES
ADC Channels: YES
No. of Terminals: 416
DMA Channels: NO
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
No. of I/O Lines: 220
Address Bus Width: 24
Technology: CMOS
JESD-30 Code: S-PBGA-B416
Maximum Clock Frequency: 20 MHz
Package Shape: SQUARE
ROM Words: 2097152
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: HBGA
Width: 27 mm
Speed: 112 rpm
Peripheral IC Type: MICROCONTROLLER
Maximum Supply Voltage: 1.65 V
RAM Bytes: 65536
External Data Bus Width: 32
Bit Size: 32
DAC Channels: NO
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA416,26X26,40
Length: 27 mm
PWM Channels: YES
Additional Features: IT ALSO REQUIRES 3.3V SUPPLY
ROM Programmability: FLASH
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 1.5,3.3,5
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