Image shown is a representation only.
| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MPC5554MZP80R2 |
| Description | MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: HBGA; Package Shape: SQUARE; |
| Datasheet | MPC5554MZP80R2 Datasheet |
| In Stock | 1,566 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.35 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.5 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 2.55 mm |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| Maximum Supply Current: | 600 mA |
| Terminal Finish: | TIN LEAD |
| ADC Channels: | YES |
| No. of Terminals: | 416 |
| DMA Channels: | NO |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Address Bus Width: | 24 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B416 |
| Maximum Clock Frequency: | 20 MHz |
| Package Shape: | SQUARE |
| ROM Words: | 2097152 |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | HBGA |
| Width: | 27 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 80 rpm |
| Peripheral IC Type: | MICROCONTROLLER |
| Maximum Supply Voltage: | 1.65 V |
| RAM Bytes: | 65536 |
| External Data Bus Width: | 32 |
| Bit Size: | 32 |
| DAC Channels: | NO |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA416,26X26,40 |
| Length: | 27 mm |
| PWM Channels: | YES |
| Additional Features: | IT ALSO REQUIRES 3.3V SUPPLY |
| Peak Reflow Temperature (C): | 245 |
| ROM Programmability: | FLASH |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | AUTOMOTIVE |
| Power Supplies (V): | 1.5,3.3,5 |
