MPC5607BF0ACMG6 by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MPC5607BF0ACMG6
Description	MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 208; Package Code: BGA; Package Shape: SQUARE;
In Stock	1,953

NAME	DESCRIPTION
Minimum Supply Voltage:	3 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Maximum Seated Height:	2 mm
Surface Mount:	YES
ADC Channels:	YES
No. of Terminals:	208
No. of Timers:	64
DMA Channels:	YES
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
No. of DMA Channels:	16
No. of I/O Lines:	147
Address Bus Width:	32
Technology:	CMOS
JESD-30 Code:	S-PBGA-B208
Maximum Clock Frequency:	16 MHz
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	BGA
Width:	17 mm
Speed:	64 rpm
Peripheral IC Type:	MICROCONTROLLER
Maximum Supply Voltage:	3.6 V
External Data Bus Width:	64
Peripherals:	DMA(16), PWM(64), TIMER(64)
Bit Size:	32
DAC Channels:	NO
Minimum Operating Temperature:	-40 Cel
Qualification:	Not Qualified
Length:	17 mm
PWM Channels:	YES
Connectivity:	CAN(6), I2C, SCI, SPI
ROM Programmability:	FLASH
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
CPU Family:	E200Z0H

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,953	-	-

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