NXP Semiconductors - MPC5607BF0BCMG4

MPC5607BF0BCMG4 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC5607BF0BCMG4
Description MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 208; Package Code: BGA; Package Shape: SQUARE;
In Stock123
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Seated Height: 2 mm
Surface Mount: YES
ADC Channels: YES
No. of Terminals: 208
No. of Timers: 64
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
No. of DMA Channels: 16
No. of I/O Lines: 147
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B208
Maximum Clock Frequency: 16 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Width: 17 mm
Speed: 48 rpm
Peripheral IC Type: MICROCONTROLLER
Maximum Supply Voltage: 3.6 V
External Data Bus Width: 64
Bit Size: 32
DAC Channels: NO
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Length: 17 mm
PWM Channels: YES
Connectivity: CAN(6), I2C, SCI, SPI
ROM Programmability: FLASH
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
CPU Family: E200Z0H
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