NXP Semiconductors - MPC5607BF0CMG4

MPC5607BF0CMG4 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC5607BF0CMG4
Description MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 208; Package Code: BGA; Package Shape: SQUARE;
Datasheet MPC5607BF0CMG4 Datasheet
In Stock241
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 2 mm
Surface Mount: YES
ADC Channels: YES
No. of Terminals: 208
No. of Timers: 8
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
No. of I/O Lines: 147
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B208
Maximum Clock Frequency: 16 MHz
Package Shape: SQUARE
ROM Words: 1572864
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Width: 17 mm
Speed: 48 rpm
Peripheral IC Type: MICROCONTROLLER
Maximum Supply Voltage: 3.6 V
External Data Bus Width: 64
Peripherals: PWM(8), TIMER(8)
Bit Size: 32
DAC Channels: NO
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Length: 17 mm
PWM Channels: YES
Connectivity: CAN, SCI, SPI
Peak Reflow Temperature (C): NOT SPECIFIED
ROM Programmability: FLASH
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
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