MPC5643AF0MMG3 by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MPC5643AF0MMG3
Description	MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 208; Package Code: BGA; Package Shape: SQUARE;
Datasheet	MPC5643AF0MMG3 Datasheet
In Stock	2,311

NAME	DESCRIPTION
Minimum Supply Voltage:	1.14 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1.2 V
Sub-Category:	Microcontrollers
Surface Mount:	YES
ADC Channels:	YES
No. of Terminals:	208
DMA Channels:	YES
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
No. of I/O Lines:	111
Address Bus Width:	32
JESD-30 Code:	S-PBGA-B208
Maximum Clock Frequency:	80 MHz
Package Shape:	SQUARE
ROM Words:	3145728
Terminal Form:	BALL
Maximum Operating Temperature:	125 Cel
Package Code:	BGA
Width:	17 mm
Speed:	80 rpm
Peripheral IC Type:	MICROCONTROLLER, RISC
Maximum Supply Voltage:	1.32 V
RAM Bytes:	196608
External Data Bus Width:	32
Bit Size:	32
Minimum Operating Temperature:	-40 Cel
Qualification:	Not Qualified
Package Equivalence Code:	BGA208,16X16,40
Length:	17 mm
PWM Channels:	YES
ROM Programmability:	FLASH
Terminal Pitch:	1 mm
Temperature Grade:	AUTOMOTIVE
Power Supplies (V):	1.2,3.3
CPU Family:	E200Z4

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,311	-	-

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OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

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Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;