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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MPC5644AF0MVZ2 |
Description | MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; |
In Stock | 4,267 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.14 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.2 V |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
ADC Channels: | YES |
No. of Terminals: | 324 |
DMA Channels: | YES |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
No. of I/O Lines: | 111 |
Address Bus Width: | 32 |
JESD-30 Code: | S-PBGA-B324 |
Maximum Clock Frequency: | 80 MHz |
Package Shape: | SQUARE |
ROM Words: | 4194304 |
Terminal Form: | BALL |
Maximum Operating Temperature: | 125 Cel |
Package Code: | BGA |
Width: | 23 mm |
Speed: | 120 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Supply Voltage: | 1.32 V |
RAM Bytes: | 196608 |
External Data Bus Width: | 32 |
Bit Size: | 32 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA324,22X22,40 |
Length: | 23 mm |
PWM Channels: | YES |
ROM Programmability: | FLASH |
Terminal Pitch: | 1 mm |
Temperature Grade: | AUTOMOTIVE |
Power Supplies (V): | 1.2,3.3 |
CPU Family: | E200Z4 |