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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MPC5675KFF0MMS2R |
Description | MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 473; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | MPC5675KFF0MMS2R Datasheet |
In Stock | 1,078 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 3 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.3 V |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
ADC Channels: | YES |
No. of Terminals: | 473 |
DMA Channels: | YES |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Address Bus Width: | 32 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B473 |
Maximum Clock Frequency: | 40 MHz |
Package Shape: | SQUARE |
ROM Words: | 2097152 |
Terminal Form: | BALL |
Maximum Operating Temperature: | 125 Cel |
Package Code: | FBGA |
Width: | 19 mm |
Speed: | 180 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Supply Voltage: | 5.5 V |
RAM Bytes: | 524288 |
External Data Bus Width: | 64 |
Bit Size: | 32 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA473,23X23,32 |
Length: | 19 mm |
PWM Channels: | YES |
ROM Programmability: | FLASH |
Terminal Pitch: | .8 mm |
Temperature Grade: | AUTOMOTIVE |
Power Supplies (V): | 3.3/5 |