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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MPC5675KFF0VMM1R |
| Description | MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 257; Package Code: FBGA; Package Shape: SQUARE; |
| Datasheet | MPC5675KFF0VMM1R Datasheet |
| In Stock | 3,949 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 3 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| ADC Channels: | YES |
| No. of Terminals: | 257 |
| DMA Channels: | YES |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| No. of I/O Lines: | 122 |
| Address Bus Width: | 32 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B257 |
| Maximum Clock Frequency: | 40 MHz |
| Package Shape: | SQUARE |
| ROM Words: | 2097152 |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | FBGA |
| Width: | 14 mm |
| Speed: | 150 rpm |
| Peripheral IC Type: | MICROCONTROLLER, RISC |
| Maximum Supply Voltage: | 5.5 V |
| RAM Bytes: | 524288 |
| External Data Bus Width: | 0 |
| Bit Size: | 32 |
| Minimum Operating Temperature: | -40 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA257,17X17,32 |
| Length: | 14 mm |
| PWM Channels: | YES |
| ROM Programmability: | FLASH |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3.3/5 |
