NXP Semiconductors - MPC604ERX266XX

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MPC604ERX266XX by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC604ERX266XX
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 255; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
In Stock3,575
NAME DESCRIPTION
Minimum Supply Voltage: 1.8 V
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Nominal Supply Voltage: 1.9 V
Integrated Cache: YES
Maximum Seated Height: 3.3 mm
Surface Mount: YES
No. of Terminals: 255
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-CBGA-B255
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 21 mm
Speed: 266 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 2 V
Low Power Mode: NO
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
Length: 21 mm
Terminal Pitch: 1.27 mm
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