NXP Semiconductors - MPC755BRX350LE

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MPC755BRX350LE by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC755BRX350LE
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;
Datasheet MPC755BRX350LE Datasheet
In Stock4,107
NAME DESCRIPTION
Minimum Supply Voltage: 1.8 V
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Nominal Supply Voltage: 2 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 3.2 mm
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 360
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-CBGA-B360
Maximum Clock Frequency: 100 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 25 mm
Moisture Sensitivity Level (MSL): 1
Speed: 350 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 2.1 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
JESD-609 Code: e0
Qualification: Not Qualified
Package Equivalence Code: BGA255,16X16,50
Length: 25 mm
Additional Features: ALSO REQUIRES 2.5V OR 3.3V SUPPLY
Peak Reflow Temperature (C): 220
Terminal Pitch: 1.27 mm
Power Supplies (V): 2,2.5/3.3
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