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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MPC755CVT350LE |
Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES; |
In Stock | 288 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.8 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 2 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 2.77 mm |
Surface Mount: | YES |
No. of Terminals: | 360 |
Terminal Position: | BOTTOM |
Format: | FLOATING POINT |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Address Bus Width: | 32 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B360 |
Maximum Clock Frequency: | 100 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | HBGA |
Width: | 25 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 350 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 2.1 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 64 |
Bit Size: | 32 |
JESD-609 Code: | e2 |
Length: | 25 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1.27 mm |