NXP Semiconductors - MPC755CVT350LE

MPC755CVT350LE by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC755CVT350LE
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
In Stock288
NAME DESCRIPTION
Minimum Supply Voltage: 1.8 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 2.77 mm
Surface Mount: YES
No. of Terminals: 360
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B360
Maximum Clock Frequency: 100 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: HBGA
Width: 25 mm
Moisture Sensitivity Level (MSL): 3
Speed: 350 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 2.1 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
JESD-609 Code: e2
Length: 25 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: 1.27 mm
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