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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MPC8247CZQTIEA |
| Description | SoC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM; |
| In Stock | 3,902 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.425 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.5 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 2.55 mm |
| Sub-Category: | Other uPs/uCs/Peripheral ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN LEAD SILVER |
| No. of Terminals: | 516 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B516 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | BGA |
| Width: | 27 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Peripheral IC Type: | SoC |
| Maximum Supply Voltage: | 1.575 V |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA516,26X26,40 |
| Length: | 27 mm |
| Peak Reflow Temperature (C): | 245 |
| Terminal Pitch: | 1 mm |
| Power Supplies (V): | 1.5,3.3 |
