NXP Semiconductors - MPC8260AVVPJDB

MPC8260AVVPJDB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8260AVVPJDB
Description MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;
In Stock4,420
NAME DESCRIPTION
Minimum Supply Voltage: 2.4 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2.5 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.65 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 480
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B480
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: LBGA
Width: 37.5 mm
Moisture Sensitivity Level (MSL): 3
Speed: 300 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 2.7 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Length: 37.5 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: 1.27 mm
Temperature Grade: OTHER
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