NXP Semiconductors - MPC8265AZUPIB

AM3354BZCZD80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

The Intel A80960KA25 microprocessor features 32-bit address and data bus width, integrated cache, and operates at a max clock frequency of 32 MHz. Ideal for applications requiring high-speed processing such as embedded systems, industrial automation, and telecommunications equipment.

Microchip AT91SAM9X25-CU-999 is a 32-bit microprocessor with 8-bit RAM, 26-bit address bus, and 32-bit external data bus. It operates at up to 16 MHz clock frequency for industrial applications. With integrated cache and low power mode, it offers high performance in a compact square package.

MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE;

MICROPROCESSOR, RISC;

NXP Semiconductors' MIMXRT1051DVL6A microprocessor features 32-bit architecture, 24 MHz clock frequency, and 524288 RAM words. Ideal for low power applications, it offers integrated cache, 29 serial I/Os, and supports boundary scan technology.

MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

MICROPROCESSOR;

MCIMX6U5EVM10ACR by NXP Semiconductors is a 32-bit microprocessor with 64-bit external data bus width, operating at max 24 MHz clock frequency. Ideal for low power applications, it features integrated cache and boundary scan support. Its grid array package style makes it suitable for compact electronic devices.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1295;

XAM6234ATCGGAALW by Texas Instruments is a 64-bit microprocessor with 8-bit on-chip data RAM and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications in various devices due to its CMOS technology and integrated cache feature. The package style is grid array with very thin profile, making it ideal for compact designs requiring high processing speeds.

NXP's MIMXRT1171AVM8A microprocessor features integrated cache, 32 DMA channels, and 48 MHz clock frequency. Ideal for automotive applications due to its low power mode, CMOS technology, and wide temperature range (-40 to 125 °C).

NXP Semiconductors' MCF5274VM166 microprocessor features 32-bit architecture, 83 MHz clock frequency, and integrated cache. Ideal for commercial applications requiring low power mode, with a temperature range of 0-70°C.

Microprocessors;

AM3517AZERC by Texas Instruments is a microprocessor with 16-bit address bus, 8-bit on-chip data RAM width, and integrated cache. It operates at a max clock frequency of 26 MHz and has low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices.

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

AM3703CUSD100 by Texas Instruments is a 32-bit microprocessor with 423 terminals, operating at up to 54 MHz. It features an integrated cache, 8-bit data RAM width, and 26-bit address bus width. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

MCF5328CVM240J by Freescale Semiconductor is a 32-bit microprocessor with integrated cache, operating at max 80 MHz. It features a 24-bit address bus width and low power mode, suitable for industrial applications requiring high-speed processing in compact devices. The package style is grid array with dimensions of 17mm x 17mm and terminal pitch of 1mm.