NXP Semiconductors - MPC8308CVMAGDA

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MPC8308CVMAGDA by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8308CVMAGDA
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 473; Package Code: LFBGA; Package Shape: SQUARE;
In Stock364
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.54 mm
Surface Mount: YES
Terminal Finish: TIN SILVER
No. of Terminals: 473
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B473
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: LFBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Speed: 400 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.05 V
No. of External Interrupts: 4
Low Power Mode: YES
Boundary Scan: YES
Bit Size: 32
JESD-609 Code: e2
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA473,23X23,32
Length: 19 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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