NXP Semiconductors - MPC8360ECVVAJDGA

MPC8360ECVVAJDGA by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8360ECVVAJDGA
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 740; Package Code: LBGA; Package Shape: SQUARE; Boundary Scan: YES;
In Stock34
NAME DESCRIPTION
Minimum Supply Voltage: 1.15 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.3 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.69 mm
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: TIN SILVER
No. of Terminals: 740
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B740
Maximum Clock Frequency: 66.67 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: LBGA
Width: 37.5 mm
Moisture Sensitivity Level (MSL): 3
Speed: 533 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.35 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
JESD-609 Code: e2
Qualification: Not Qualified
Package Equivalence Code: BGA740,37X37,40
Length: 37.5 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: 1 mm
Power Supplies (V): 1.8/2.5,3.3
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