NXP Semiconductors - MPC8378ECVRAJG

MPC8378ECVRAJG by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8378ECVRAJG
Description MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 689; Package Code: HBGA; Package Shape: SQUARE;
Datasheet MPC8378ECVRAJG Datasheet
In Stock4,297
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1 V
Integrated Cache: YES
Maximum Seated Height: 2.46 mm
Surface Mount: YES
No. of Terminals: 689
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
No. of DMA Channels: 4
Address Bus Width: 15
Technology: CMOS
JESD-30 Code: S-PBGA-B689
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: HBGA
Width: 31 mm
Speed: 533 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.05 V
No. of External Interrupts: 8
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA689,29X29,40
Length: 31 mm
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
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