NXP Semiconductors - MPC8378EVRAJD

MPC8378EVRAJD by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8378EVRAJD
Description MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 689; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
Datasheet MPC8378EVRAJD Datasheet
In Stock3,478
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 2.46 mm
Surface Mount: YES
No. of Terminals: 689
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Technology: CMOS
JESD-30 Code: S-PBGA-B689
Maximum Clock Frequency: 66.66 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: HBGA
Width: 31 mm
Speed: 533 rpm
Peripheral IC Type: MICROPROCESSOR
Maximum Supply Voltage: 1.05 V
Low Power Mode: YES
Boundary Scan: YES
Bit Size: 32
Length: 31 mm
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: 1 mm
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