NXP Semiconductors - MPC8541ECPXAPEX

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MPC8541ECPXAPEX by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8541ECPXAPEX
Description MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
Datasheet MPC8541ECPXAPEX Datasheet
In Stock1,043
NAME DESCRIPTION
Minimum Supply Voltage: 1.2 V
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Nominal Supply Voltage: 1.25 V
Integrated Cache: YES
Maximum Seated Height: 2.4 mm
Surface Mount: YES
No. of Terminals: 360
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 36
Technology: CMOS
JESD-30 Code: S-CBGA-B360
Maximum Clock Frequency: 200 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Width: 25 mm
Speed: 1600 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.3 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
Minimum Operating Temperature: 0 Cel
Qualification: Not Qualified
Length: 25 mm
Additional Features: LOW POWER TAKEN FROM SLEEP MODE
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
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