NXP Semiconductors - MPC8545EPXANGC

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MPC8545EPXANGC by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8545EPXANGC
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE; Low Power Mode: YES;
Datasheet MPC8545EPXANGC Datasheet
In Stock133
NAME DESCRIPTION
Minimum Supply Voltage: 1.045 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.1 V
Integrated Cache: YES
Maximum Seated Height: 3.38 mm
Surface Mount: YES
Terminal Finish: TIN LEAD SILVER
No. of Terminals: 783
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 64
Technology: CMOS
JESD-30 Code: S-PBGA-B783
Maximum Clock Frequency: 133 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 29 mm
Speed: 800 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.155 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
JESD-609 Code: e0
Length: 29 mm
Terminal Pitch: 1 mm
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