
Image shown is a representation only.
Manufacturer | NXP Semiconductors |
---|---|
Manufacturer's Part Number | MPC8569CVJAQLJB |
Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1,2.5/3.3; |
Datasheet | MPC8569CVJAQLJB Datasheet |
In Stock | 4,597 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Speed: | 1067 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Sub-Category: | Microprocessors |
Surface Mount: | YES |
Bit Size: | 32 |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
No. of Terminals: | 783 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA783,28X28,40 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B783 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Peak Reflow Temperature (C): | 245 |
Package Code: | BGA |
Terminal Pitch: | 1 mm |
Power Supplies (V): | 1,2.5/3.3 |
Moisture Sensitivity Level (MSL): | 3 |