NXP Semiconductors - MPC8569VJAQLJB

MPC8569VJAQLJB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8569VJAQLJB
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B783;
Datasheet MPC8569VJAQLJB Datasheet
In Stock3,470
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Speed: 1067 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Microprocessors
Surface Mount: YES
Bit Size: 32
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
No. of Terminals: 783
Qualification: Not Qualified
Package Equivalence Code: BGA783,28X28,40
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B783
Package Shape: SQUARE
Terminal Form: BALL
Peak Reflow Temperature (C): 245
Package Code: BGA
Terminal Pitch: 1 mm
Power Supplies (V): 1,2.5/3.3
Moisture Sensitivity Level (MSL): 3
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Pricing (USD)

Qty. Unit Price Ext. Price
3,470 $202.840 $703,854.800

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