NXP Semiconductors - MPC857DSLZP66B

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MPC857DSLZP66B by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC857DSLZP66B
Description MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE;
Datasheet MPC857DSLZP66B Datasheet
In Stock3,963
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Speed: 66 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Nominal Supply Voltage: 3.3 V
Sub-Category: Microprocessors
Surface Mount: YES
Bit Size: 32
Minimum Operating Temperature: 0 Cel
No. of Terminals: 357
Qualification: Not Qualified
Package Equivalence Code: BGA357,19X19,50
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
JESD-30 Code: S-PBGA-B357
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: BGA
Terminal Pitch: 1.27 mm
Temperature Grade: OTHER
Power Supplies (V): 3.3
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