NXP Semiconductors - MPC859TVR133A

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MPC859TVR133A by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC859TVR133A
Description MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE;
In Stock3,728
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.52 mm
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 357
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B357
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 95 Cel
Package Code: BGA
Width: 25 mm
Moisture Sensitivity Level (MSL): 3
Speed: 133 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.9 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA357,19X19,50
Length: 25 mm
Peak Reflow Temperature (C): 245
Terminal Pitch: 1.27 mm
Temperature Grade: OTHER
Power Supplies (V): 1.8,3.3
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Pricing (USD)

Qty. Unit Price Ext. Price
3,728 $47.310 $176,371.680

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