MPC860TZP50 by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MPC860TZP50
Description	MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: RECTANGULAR;
Datasheet	MPC860TZP50 Datasheet
In Stock	3,364

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Integrated Cache:	YES
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Surface Mount:	YES
No. of Terminals:	357
Terminal Position:	BOTTOM
Format:	FIXED POINT
Package Style (Meter):	GRID ARRAY
Address Bus Width:	32
Technology:	CMOS
JESD-30 Code:	R-PBGA-B357
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	70 Cel
Package Code:	BGA
Speed:	50 rpm
Peripheral IC Type:	MICROPROCESSOR, RISC
Low Power Mode:	YES
Boundary Scan:	YES
External Data Bus Width:	32
Bit Size:	32
Minimum Operating Temperature:	0 Cel
Peak Reflow Temperature (C):	NOT SPECIFIED
Temperature Grade:	COMMERCIAL

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,364	-	-

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