NXP Semiconductors - MPC875VR66

MPC875VR66 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC875VR66
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: HBGA; Package Shape: SQUARE; JESD-609 Code: e1;
In Stock821
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.54 mm
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 256
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B256
Package Shape: SQUARE
Terminal Form: BALL
Package Code: HBGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Speed: 66 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.9 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
JESD-609 Code: e1
Qualification: Not Qualified
Package Equivalence Code: BGA256,16X16,50
Length: 23 mm
Peak Reflow Temperature (C): 245
Terminal Pitch: 1.27 mm
Power Supplies (V): 1.8,3.3
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