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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MPC880ZP66 |
| Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA357,19X19,50; |
| In Stock | 1,106 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.7 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.8 V |
| Integrated Cache: | YES |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 2.52 mm |
| Sub-Category: | Microprocessors |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Lead (Sn/Pb) |
| No. of Terminals: | 357 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY |
| Address Bus Width: | 32 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B357 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | BGA |
| Width: | 25 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 66 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Supply Voltage: | 1.9 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 32 |
| Bit Size: | 32 |
| JESD-609 Code: | e0 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA357,19X19,50 |
| Length: | 25 mm |
| Peak Reflow Temperature (C): | 245 |
| Terminal Pitch: | 1.27 mm |
| Power Supplies (V): | 1.8,3.3 |









