NXP Semiconductors - MPE603ERX133LX

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MPE603ERX133LX by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPE603ERX133LX
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 255; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;
In Stock1,447
NAME DESCRIPTION
Minimum Supply Voltage: 3.135 V
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Nominal Supply Voltage: 3.3 V
Integrated Cache: YES
Maximum Seated Height: 3 mm
Surface Mount: YES
No. of Terminals: 255
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-CBGA-B255
Maximum Clock Frequency: 66.67 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 21 mm
Speed: 133.33 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 3.465 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
Qualification: Not Qualified
Length: 21 mm
Terminal Pitch: 1.27 mm
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Pricing (USD)

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