MR2S8AYS35 by NXP Semiconductors | Memory ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MR2S8AYS35
Description	MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Data Retention Time: 20;
In Stock	911

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.012 Amp
Organization:	512KX8
Maximum Seated Height:	1.2 mm
Minimum Supply Voltage (Vsup):	3 V
Surface Mount:	YES
Maximum Supply Current:	155 mA
Maximum Write Cycle Time (tWC):	.000035 ms
No. of Terminals:	44
No. of Words:	524288 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE
Technology:	CMOS
JESD-30 Code:	R-PDSO-G44
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	TSOP2
Width:	10.16 mm
Memory Density:	4194304 bit
Minimum Standby Voltage:	3 V
Memory IC Type:	MRAM
Minimum Operating Temperature:	0 Cel
Memory Width:	8
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	TSOP44,.46,32
Length:	18.41 mm
Maximum Access Time:	35 ns
No. of Words Code:	512K
Nominal Supply Voltage / Vsup (V):	3.3
Minimum Data Retention Time:	20
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	3.6 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
911	-	-

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