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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MSC7119VF1200 |
| Description | DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 0; |
| In Stock | 2,830 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.14 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.2 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.6 mm |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Lead (Sn/Pb) |
| No. of Terminals: | 400 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Address Bus Width: | 0 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B400 |
| Maximum Clock Frequency: | 300 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | LFBGA |
| Width: | 17 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Peripheral IC Type: | DIGITAL SIGNAL PROCESSOR, OTHER |
| Maximum Supply Voltage: | 1.26 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 0 |
| Barrel Shifter: | NO |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 Cel |
| Internal Bus Architecture: | MULTIPLE |
| Qualification: | Not Qualified |
| Length: | 17 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
