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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MSC8101M1375F |
| Description | DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: BALL; No. of Terminals: 332; Package Code: FBGA; Package Shape: SQUARE; Address Bus Width: 32; |
| Datasheet | MSC8101M1375F Datasheet |
| In Stock | 4,264 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.5 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.6 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 3.18 mm |
| Sub-Category: | Digital Signal Processors |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Lead/Silver (Sn/Pb/Ag) |
| No. of Terminals: | 332 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Address Bus Width: | 32 |
| Technology: | CMOS |
| RAM Words: | 262144 |
| JESD-30 Code: | S-PBGA-B332 |
| Maximum Clock Frequency: | 68.75 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | FBGA |
| Width: | 17 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Peripheral IC Type: | DIGITAL SIGNAL PROCESSOR, OTHER |
| Maximum Supply Voltage: | 1.7 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 64 |
| Bit Size: | 16 |
| Barrel Shifter: | NO |
| JESD-609 Code: | e0 |
| Internal Bus Architecture: | SINGLE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA357,19X19,50 |
| Length: | 17 mm |
| Peak Reflow Temperature (C): | 220 |
| Terminal Pitch: | .8 mm |
| Power Supplies (V): | 1.6,3.3 |
