MSC8144ETVT1000B by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MSC8144ETVT1000B
Description	DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: Tin/Silver (Sn/Ag);
Datasheet	MSC8144ETVT1000B Datasheet
In Stock	2,947

NAME	DESCRIPTION
Minimum Supply Voltage:	.97 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	3.176 mm
Surface Mount:	YES
Terminal Finish:	Tin/Silver (Sn/Ag)
No. of Terminals:	783
Terminal Position:	BOTTOM
Format:	FIXED POINT
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	S-PBGA-B783
Maximum Clock Frequency:	133 MHz
Package Shape:	SQUARE
Terminal Form:	BALL
Package Code:	BGA
Width:	29 mm
Moisture Sensitivity Level (MSL):	3
Peripheral IC Type:	DIGITAL SIGNAL PROCESSOR, OTHER
Maximum Supply Voltage:	1.05 V
Low Power Mode:	NO
Boundary Scan:	YES
Barrel Shifter:	NO
JESD-609 Code:	e2
Internal Bus Architecture:	MULTIPLE
Qualification:	Not Qualified
Length:	29 mm
Peak Reflow Temperature (C):	245
Terminal Pitch:	1 mm

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,947	-	-

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