NXP Semiconductors - MSC8151SAG1000B

MSC8151SAG1000B by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MSC8151SAG1000B
Description DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 245;
In Stock645
NAME DESCRIPTION
Minimum Supply Voltage: .97 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 3.94 mm
Sub-Category: Digital Signal Processors
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals: 783
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY
Technology: CMOS
RAM Words: 8192
JESD-30 Code: S-PBGA-B783
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 29 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER
Maximum Supply Voltage: 1.05 V
Low Power Mode: YES
Boundary Scan: YES
Bit Size: 32
Barrel Shifter: NO
JESD-609 Code: e1
Internal Bus Architecture: SINGLE
Qualification: Not Qualified
Package Equivalence Code: BGA783,28X28,40
Length: 29 mm
Peak Reflow Temperature (C): 245
Terminal Pitch: 1 mm
Power Supplies (V): 1,2.5
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