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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MSC8151SAG1000B |
Description | DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 245; |
In Stock | 645 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .97 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 3.94 mm |
Sub-Category: | Digital Signal Processors |
Surface Mount: | YES |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
No. of Terminals: | 783 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
RAM Words: | 8192 |
JESD-30 Code: | S-PBGA-B783 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | BGA |
Width: | 29 mm |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | DIGITAL SIGNAL PROCESSOR, OTHER |
Maximum Supply Voltage: | 1.05 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
Bit Size: | 32 |
Barrel Shifter: | NO |
JESD-609 Code: | e1 |
Internal Bus Architecture: | SINGLE |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA783,28X28,40 |
Length: | 29 mm |
Peak Reflow Temperature (C): | 245 |
Terminal Pitch: | 1 mm |
Power Supplies (V): | 1,2.5 |