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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MSC8156ETAG1000B |
| Description | DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 245; |
| Datasheet | MSC8156ETAG1000B Datasheet |
| In Stock | 688 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | DIGITAL SIGNAL PROCESSOR, OTHER |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Sub-Category: | Digital Signal Processors |
| Surface Mount: | YES |
| Bit Size: | 32 |
| Terminal Finish: | TIN SILVER COPPER |
| JESD-609 Code: | e1 |
| No. of Terminals: | 783 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA783,28X28,40 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| RAM Words: | 8192 |
| JESD-30 Code: | S-PBGA-B783 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Peak Reflow Temperature (C): | 245 |
| Package Code: | BGA |
| Terminal Pitch: | 1 mm |
| Power Supplies (V): | 1,1.5/1.8,2.5 |
| Moisture Sensitivity Level (MSL): | 3 |
