NXP Semiconductors - MSCMMX6QZDK08AB

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MSCMMX6QZDK08AB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MSCMMX6QZDK08AB
Description MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 500; Package Code: FBGA; Package Shape: RECTANGULAR;
Datasheet MSCMMX6QZDK08AB Datasheet
In Stock2,288
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.8 mm
Surface Mount: YES
No. of Terminals: 500
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, FINE PITCH
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: R-PBGA-B500
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Width: 14 mm
Moisture Sensitivity Level (MSL): 3
Speed: 800 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 0
Minimum Operating Temperature: 0 Cel
Length: 17 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .65 mm
Temperature Grade: OTHER
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