NXP Semiconductors - N74F225N

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N74F225N by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number N74F225N
Description FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
Datasheet N74F225N Datasheet
In Stock2,372
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 16X5
Output Characteristics: 3-STATE
Maximum Seated Height: 4.2 mm
Minimum Supply Voltage (Vsup): 4.5 V
Surface Mount: NO
Cycle Time: 40 ns
No. of Terminals: 20
No. of Words: 16 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: TTL
JESD-30 Code: R-PDIP-T20
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: DIP
Width: 7.62 mm
Memory Density: 80 bit
Minimum Operating Temperature: 0 Cel
Memory Width: 5
Output Enable: YES
No. of Functions: 1
Qualification: Not Qualified
Length: 26.73 mm
Maximum Access Time: 22 ns
No. of Words Code: 16
Nominal Supply Voltage / Vsup (V): 5
Parallel or Serial: PARALLEL
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 5.5 V
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