NXP Semiconductors - N74F825DB

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N74F825DB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number N74F825DB
Description D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
Datasheet N74F825DB Datasheet
In Stock1,047
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Output Characteristics: 3-STATE
Trigger Type: POSITIVE EDGE
Sub-Category: FF/Latches
Maximum Power Supply Current (ICC): 95 mA
Surface Mount: YES
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 24
Maximum I (ol): 64 Amp
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
Maximum Frequency At Nominal Supply: 140000000 Hz
Technology: TTL
JESD-30 Code: R-PDSO-G24
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 70 Cel
Package Code: SOP
Propagation Delay At Nominal Supply: 10 ns
Logic IC Type: D FLIP-FLOP
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
No. of Functions: 8
Package Equivalence Code: SOP24,.4
Nominal Supply Voltage / Vsup (V): 5
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 5
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