NXP Semiconductors - N82S153AFB

N82S153AFB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number N82S153AFB
Description OT PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet N82S153AFB Datasheet
In Stock3,470
NAME DESCRIPTION
Package Body Material: Ceramic
Propagation Delay: 30 ns
No. of Inputs: 18
Sub-Category: Programmable Logic Devices
Surface Mount: No
No. of Outputs: 10
Position Of Terminal: Dual
No. of Terminals: 20
Package Style (Meter): In-Line
JESD-30 Code: R-XDIP-T20
Package Shape: Rectangular
Maximum Operating Temperature: 70 °C (158 °F)
Package Code: DIP
Grading Of Temperature: Commercial
Programmable IC Type: OT PLD
Architecture: PLA-TYPE
No. of Product Terms: 42
Nominal Supply Voltage (V): 5
Technology Used: TTL
JESD-609 Code: e0
Minimum Operating Temperature: 0 °C (32 °F)
Package Equivalence Code: DIP20,.3
Finishing Of Terminal Used: Tin/Lead
Form Of Terminal: Through-Hole
Pitch Of Terminal: 2.54 mm
Power Supplies (V): 5 V
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Pricing (USD)

Qty. Unit Price Ext. Price
3,470 - -

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