NXP Semiconductors - NT2H0301F0DTL

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NT2H0301F0DTL by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number NT2H0301F0DTL
Description MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR;
Datasheet NT2H0301F0DTL Datasheet
In Stock370
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Seated Height: .8 mm
Sub-Category: Serial IO/Communication Controllers
Surface Mount: YES
Minimum Operating Temperature: -25 Cel
No. of Terminals: 8
Qualification: Not Qualified
Package Equivalence Code: SOLCC4,.08,20
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Length: 3 mm
Technology: CMOS
JESD-30 Code: R-PDSO-N8
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Maximum Operating Temperature: 70 Cel
Package Code: HVSON
Width: 2 mm
Terminal Pitch: .5 mm
Temperature Grade: OTHER
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Pricing (USD)

Qty. Unit Price Ext. Price
370 $0.330 $122.100

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